AM Intelligence Orders 9,000 NVIDIA Rubin GPUs for Hyderabad AI Factory

AM Intelligence, an infrastructure platform established by the promoters of Greenko, announced on Tuesday, August 25, 2026, that it has placed a binding order for 9,000 NVIDIA Rubin GPUs for its upcoming AI factory in Hyderabad.

The hardware will be deployed as Vera Rubin NVL72 systems at the company's 30 MW facility in Hyderabad during the first quarter of 2027. According to a company press release, the installation is expected to rank among the first frontier artificial intelligence computing clusters in Asia to utilize the Vera Rubin platform.

The upcoming Hyderabad facility represents the initial phase of AM Intelligence's broader roadmap to deliver 1 GW of Compute-as-a-Service capacity across international markets, including India, the United States, Finland, and Malaysia. In the near term, the company intends to bring 200 MW of capacity online, representing a capital expenditure exceeding USD 8 billion.

Speaking on the development, AM Intelligence Chairman Anil Chalamalasetty highlighted the shift toward power-backed computing infrastructure. He noted that the company has focused for over two decades on transforming energy into value to address societal needs. He stated that the electron-to-token opportunity allows the organization to convert power infrastructure into frontier AI compute at scale, and that deploying the latest-generation NVIDIA Vera Rubin platform in India positions the company at the forefront of the emerging AI economy.

In total, AM Intelligence is working on developing 5 GW of powered AI data centres across India, the United States, and Europe. The initiative integrates energy systems with high-density computing infrastructure designed to cater to hyperscalers, sovereign AI initiatives, frontier research laboratories, and AI-native enterprises.

The data centre facilities are engineered specifically for high-density AI computing requirements. To manage the substantial thermal and electrical loads generated by advanced AI chips, the infrastructure will incorporate liquid cooling technologies. Additionally, the company stated that the facilities are being constructed with the capacity to support successive generations of advanced AI silicon.